M-3 nonwoven airlaid cleanroom papers free samples - M-3

M-3 nonwoven airlaid cleanroom papers free samples

Specifications for M-3 nonwoven airlaid cleanroom papers free samples:

1. Material: Nonwoven cloth with wood fiber;

2. Size: 25cm*25cm;

3. Package: 100pcs/bag, 30bags/ctn;

4. MOQ: 300bags.

1. Fine dust extraction effect with anti-static function;

2. Provide adequate dry and wet strength;

3. Low ion release;

4. Unlikely to cause a chemical reaction;

5. High resilience,soft,good feel,superior absorbency and favorable water retaining capacity;

6. As daily cleaning papers with multi-purpose wiping wet system;

7. High humidity either in wet or dry conditions;

8. Anti-acid,resistant to most chemical reagents;

9. Effectively control the amount of static electricity;

10. Can be used repeatedly;

11. Particles and lint will not be remained after wiping;

12. Powerful decontamination capacity;

13. Optional edge sealing, cold cut,laser sealing and ultrasonic sealing;

14. Economical and clean,most widely used paper wipes in electronic industry;

15. In addition to the size of 9*9,6*6,4*4, it is up to customers' requirements.

Functions for M-3 nonwoven airlaid cleanroom papers free samples:

1.High water absorption;

2.strong,durable,highly absorbent and chemically pure;

3.soft,tough and lofty wipers will not scratch surfaces when used either wet or dry,easy to clean sensitive surfaces;

4.perfect edge sealing, decrease the particle amount that produced by the cloth edge to the greatest extent;

5.low in soluble extractables and metallic ions;

6.converted,cleaned and doublebag packaged in our cleanroom to ensure cleanroom wipers quality;

7.optional sealing side usually have cold cutting,laser sealing side and ultrasonic sealing side;

8.Hydroentangled polyester, soft, very low NVR values, ideal for wiping optical surfaces etc.

Applications for M-3 nonwoven airlaid cleanroom papers free samples:

1. Semiconductor product line chips, microprocessor;

2. Semiconductor assembling line, SMT product line;

3. Disc driver, composite materials;

4. LCD/LED display products;

5. Circuit board production line;

6. Precision equipment;

7. Optoelectronic industry;

8. Aviation industry;

9. PCB products;

10. Medical apparatus;

11. Laboratory;

12. Cosmetic industry etc.